Items | BHy2CLI | FW | BSX4 | BHy SensorAPI | COINES SDK | Supported Boards | Supported Sensors |
---|---|---|---|---|---|---|---|
version | 0.6.0 | 1.1.18 | IR84.3 | 2.2.0 | 2.10.2 | APP30 APP31 |
BHI360 |
To clone this repository along with all its submodules, use the following command:
git clone --recursive https://github.com/boschsensortec/BHy2CLI.git
If you have already cloned the repository without submodules, you can initialize and update them using:
git submodule update --init --recursive
To ensure submodules remain up to date when pulling the latest changes, run:
git pull --recurse-submodules
Then, update the submodules using:
git submodule update --recursive
- By default, BHI360 will be cloned as submodule and the source code and Makefile locate the BHI360 sensor API v2.2.0 under "submodules/bhi360".
-
Other BHI sensorAPI folder can be cloned inside the submodules
-
Update the Makefile of the CLI to include definitions and source code for the new sensor API. Follow these steps:
- Add the location of the new sensor API:
CLIxxx_API_LOCATION ?= submodules/bhixxx
- Add the source files of the new sensor API to the build process:
CLIxxx_API_SRCS := $(wildcard $(CLIxxx_API_LOCATION)/*.c)
- Include the source files in the list of C source files:
C_SRCS += \ $(CLIxxx_API_SRCS) \
- Add the API location to the include paths:
INCLUDEPATHS += . \ $(CLIxxx_API_LOCATION) \
- Add the location of the new sensor API:
-
In "bhy_defs.c", locate the
all_sensor_api_entry
array definition. Add the new api_entry inside. This ensures the CLI can recognize and use the new sensor API. For example:#include "bhixxx_api_entry.h" #include "bhixxx_defs.h"
static const ChipAPIEntry all_sensor_api_entry[] = { ..., { BHIxxx_CHIP_ID, bhixxx_sensor_api_entry }, { 0, NULL } /* End of * table * marker */ };
Release package helps to generate executables and binaries of BHy2CLI , which can then be used to test BHy2CLI Application on PC/MCU in Application Board APP3.0 / APP3.1
1.Open powershell in root directory of BHy2CLI project.
2.For TARGET PC, run .\scripts\build.bat
3.For TARGET MCU_APP30, run .\scripts\build_app30.bat
4.For TARGET MCU_APP31, run .\scripts\build_app31.bat
- BHI3-firmwares/BHI360 : Holds BHI360 firmwares
- firmware : Holds bootloader, coines_bridge and MTP firmwares for APP3.0 and APP3.1
- MCU : Holds APP3.0 and APP3.1 BHy2CLI binaries (I2C, SPI) and batch files to write BHI360 firmwares (present in BHI3-firmwares/BHI360) to External FLASH
- PC : Holds executables for BHy2CLI (I2C, SPI) and decompressor
- Executables are present in,
- PC/bin/x86 for 32-bit compiler
- PC/bin/x64 for 64-bit compiler
- tools : Holds app_switch and usb-dfu files required to flash coines_bridge firmware (for TARGET PC) and to write BHI360 firmwares to External FLASH (for TARGET MCU_APP30 and MCU_APP31)
- Refer Section 2 of BHy2CLI_User_Guide.pdf (From docs/ folder)